International Business News
Temasek plans $704m bond offering
Afp, Singapore
State-linked Singapore investment firm Temasek Holdings said Monday it was planning a bond offering worth one billion Singapore dollars (704 million US) as part of its capital-raising programme.
The bonds are due in 2020 and will be issued by its wholly-owned subsidiary Temasek Financial, it said in a statement.
The bonds will pay an annual yield of 3.265 percent, Temasek said.
It said proceeds from the bond sale would help pay for the "ordinary course of business" for itself and its holding companies.
Temasek said the planned bond offering was part of a 10-billion-US-dollar bond programme, which it had increased from five billion dollars last week to cater for any possible future issues.
Global risk evaluator Moody's Investors Service on Monday assigned its top rating to the latest planned offering.